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Omron 3D AOI VT-S1080
Specifications:
	
 
	
 
	Next generation 3D AOI
The VT-S1080 is the world’s most advanced 3D AOI system, designed for maximum System Performance and High-Quality Productivity. Designed for flexible manufacturing, saving manpower with innovative AI Programming.
First Pass Yield efficiency up to 99%
Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated solder shapes
Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors
Realization of Solder Wetting Direction directly relating to IPC Standards
Innovative AI tools that support skill-less labor-saving tuning
Full 3D compliance to IPC – based inspection
Advanced angle-view inspection of hidden solder joints
Developed with I4.0 in mind for advanced Machine to Machine communication
Multi-lateral system monitoring and Predictive Maintenance for 100%, utilization for Production
Global Library to maintain the same quality standard of manufacturing in all global sites
High reliability OCR / OCV image detection
Unique Single Hardware across all S10 Series Platform
Prepared for the next-generation hardware, camera/GPU/PC for higher detectability/speed capability
 
	Features
s1080 features tab images misc
AI-assisted qualitative inspection conforming to international standards
Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.

AI technology to minimize programming and visual inspection efforts
1. AI self-optimization

2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination

3. Visualization of the AI-determined settings 
	
High-precision solder shape reconstruction
Equipped with our unique MDMC (Multi Direction/Multi Color) illumination and new MPS (Micro Phase Patented Shift) moiré technique. This enables higher robust and reliable inspection performance.

M2M*1 system focusing on quality
1. Preventing defects by:
monitoring and reporting fluctuations in the measured values during production
visualizing defect trends associated with chip mounter hardware such as heads and nozzles
2. Visualizing the quality by:
process comparison
displaying production status 
linking SPI/AOI/AXI systems
3. Improving the first pass yield rate of the line by automatically calculating post-print/post-placement inspection criteria based on the    inspection results after the solder reflow process

*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
 
	 
	 
						Type 
					 
						VT-S1080 
					 
						Outer dimensions 
					 
						1180(W) x 1450(D) x 1500(H)mm 
					 
						Weight 
					 
						Approx. 1250 kg 
					 
						  
					 
						  
					 
						Power supply 
					 
						Voltage 
					 
						200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 
					 
						Rated power 
					 
						2.0 kVA (Maximum current 10 A) 
					 
						Line height 
					 
						900±20mm 
					 
						Air supply 
					 
						Not required 
					 
						Operating temperature range 
					 
						  
					 
						10 to 35°C 
					 
						Operating humidity range 
					 
						 35 to 80% RH (Non-condensing) 
					 
						 
					 
						  
					 
						  
					 
						  
					 
						Vision system 
					 
						Imaging system 
					 
						12M pixel camera 
					 
						Inspection principle 
					 
						MDMC*1 illumination + 3D reconstruction through MPS*2 technology 
					 
						Image resolution 
					 
						12.5µm 
					 
						FOV 
					 
						50.0 x 37.5mm 
					 
						Supported PCB size 
					 
						50(W) x 50(D)~510(W) x 680(D)mm 
					 
						Weight 
					 
						(Max) 4 kg 
					 
						Thickness 
					 
						0.4~4mm 
					 
						  
					 
						Clearance 
					 
						Above the conveyor belt: 54 mm or less; Below the conveyor belt: 50 mm or less 
					 
						(Including board thickness/curvature/bend/part tolerance, etc.) 
					 
						Height measurement range 
					 
						  
					 
						25mm 
					 
						  
					 
						  
					 
						  
					 
						Inspection item 
					 
						Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component, OCR inspection,  2D code, component  offset  (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle 
					
		
			
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SMT AOI Machine, Offline AOI Machine, Inline AOI Machine, SMT X Ray Machine, SMT SPI Machine, 3D SPI Machine, 3D AOI Machine.




Contact: Mr Tommy
Phone: +86 13691605420
Tel: +86 -755-85225569
Email: tommy@flason-smt.com
Add: 94#,Guangtian Road,Songgang Street,Bao an District Shenzhen China